| Item Name | Semiconductor Device Diode |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 00-497-4091 (004974091) |
| NCB Code | USA (00) |
| Manufacturer | Texas Instruments Inc, Frequency Electronics Inc, Avago Technologies Us Inc, Raytheon Company, Micrometrics Inc, Semi General Inc, Hewlett-Packard Company, Semic Rf Electronic Gmbh, Cobham Advanced Electronic Solutions Inc, Fei Microwave Inc |
| Part Number | Manufacturer | Item Name | Cage Code | RFQ |
|---|---|---|---|---|
| TIV304 | texas instruments inc | semiconductor device diode | 01295 | RFQ |
| A2X278 | frequency electronics inc | semiconductor device diode | 14844 | RFQ |
| 5082-2187 | avago technologies us inc | semiconductor device diode | 50434 | RFQ |
| 532245-2 | raytheon company | semiconductor device diode | 96214 | RFQ |
| UX532245-2 | micrometrics inc | semiconductor device diode | 0eff4 | RFQ |
| UX532245-2 | semi general inc | semiconductor device diode | 3bby6 | RFQ |
| 5082-2187 | hewlett-packard company | semiconductor device diode | 28480 | RFQ |
| MA-4E095 | semic rf electronic gmbh | semiconductor device diode | dg438 | RFQ |
| MA-4E095 | cobham advanced electronic solutions inc | semiconductor device diode | 96341 | RFQ |
| A2X278 | fei microwave inc | semiconductor device diode | 21847 | RFQ |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 0.180 INCHES MAXIMUM |
| ABJT | TERMINAL LENGTH | 1.000 INCHES MINIMUM |
| ADAV | OVERALL DIAMETER | 0.080 INCHES MAXIMUM |
| AXGY | MOUNTING METHOD | TERMINAL |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED CASE |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 10.00 MINIMUM BREAKDOWN VOLTAGE,DC AND 0.62 MAXIMUM FORWARD VOLTAGE,DC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 0.10 MICROAMPERES MAXIMUM REVERSE CURRENT,DC |
| CTRD | POWER RATING PER CHARACTERISTIC | 100.0 MILLIWATTS MAXIMUM TOTAL POWER DISSIPATION |
| CTSG | MAXIMUM OPERATING TEMP PER MEASUREMENT POINT | 100.0 DEG CELSIUS AMBIENT AIR |
| MATT | MATERIAL | GLASS INCLOSURE |
| MATT | MATERIAL | SILICON SEMICONDUCTOR |
| TEST | TEST DATA DOCUMENT | 96214-532245 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWI |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 UNINSULATED WIRE LEAD |
| Relevant Components for NSN - 5961-00-497-4091, 5961004974091 | ||||
| 5980-01-127-9290 (5980011279290) | 5930-01-333-3189 (5930013333189) | 5998-01-566-8414 (5998015668414) | 5962-01-414-8707 (5962014148707) | |
| 5905-01-156-4926 (5905011564926) | 5970-01-662-0059 (5970016620059) | 5945-01-327-8772 (5945013278772) | 5905-01-020-1453 (5905010201453) | |
| 5962-01-112-3586 (5962011123586) | 5998-00-042-9502 (5998000429502) | 5999-01-020-7611 (5999010207611) | 5905-00-499-6434 (5905004996434) | |
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