| Item Name | Semiconductor Device Diode |
| Federal Supply Group (FSG) | Electrical and Electronic Equipment Components |
| Federal Supply Class (FSC) | 5961 Semiconductor Devices and Associated Hardware |
| National Item Identification Number (NIIN) | 01-502-3723 (015023723) |
| NCB Code | USA (01) |
| Manufacturer | Microsemi Corporation |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABBH | INCLOSURE MATERIAL | GLASS |
| ABHP | OVERALL LENGTH | 0.130 INCHES MINIMUM AND 0.146 INCHES MAXIMUM |
| ADAV | OVERALL DIAMETER | 0.063 INCHES MINIMUM AND 0.067 INCHES MAXIMUM |
| AGAV | END ITEM IDENTIFICATION | F/A-18E/F HORNET AIRCRAFT; CENTRAL PROCESSOR |
| ALAZ | JOINT ELECTRONIC DEVICE ENGINEERING COUNCIL/JEDEC/CASE OUTLINE DESIGNATION | DO-213AA |
| AXGY | MOUNTING METHOD | TERMINAL |
| CTMZ | SEMICONDUCTOR MATERIAL | SILICON |
| CTQN | VOLTAGE RATING IN VOLTS PER CHARACTERISTIC | 4.7 MAXIMUM REGULATOR VOLTAGE, DC |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 75.00 MILLIAMPERES SOURCE CUTOFF CURRENT HORSEPOWER METRIC AND 2.00 MILLIAMPERES FORWARD CURRENT, AVERAGE PEAK |
| TTQY | TERMINAL TYPE AND QUANTITY | 2 BONDING PAD |
| Relevant Components for NSN - 5961-01-502-3723, 5961015023723 | ||||
| 5930-01-525-6743 (5930015256743) | 5905-00-112-5274 (5905001125274) | 5962-01-367-6024 (5962013676024) | 5975-00-280-9809 (5975002809809) | |
| 5962-01-668-1209 (5962016681209) | 5995-01-429-6663 (5995014296663) | 5945-00-259-0525 (5945002590525) | 5999-01-201-4414 (5999012014414) | |
| 5985-01-312-4125 (5985013124125) | 5962-01-295-0963 (5962012950963) | 5935-01-408-8097 (5935014088097) | 5998-01-408-9093 (5998014089093) | |
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