Whether you are in search of military and defense parts, aerospace parts, or other similar product solutions, Satellite To Submarine Parts is your one-stop shop. Thank you for your interest in part number 91L02DM-B, a Advanced Micro Devices Inc item that is listed alongside the description “Microcircuit Memory” and the NSN 5962010436195. To guarantee a swift procurement process for NSN part number 91L02DM-B, be sure to request a quote by filling out and submitting the RFQ form below, and one of our experts will offer a customized solution for your comparisons in response.
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We list everything with as much relevant information as possible to ensure that customers can swiftly identify and procure the exact products they need. For instance, while part number 91L02DM-B is manufactured by Advanced Micro Devices Inc, it is specifically done so under CAGE Code 34335, a unique identifier assigned to a particular facility by the DLA that supplies to various government or defense agencies. Additionally, using the first digits of the NSN 5962-01-043-6195, one can also determine that this part falls under FSC 5962 Microcircuits Electronic. Keeping this in mind, initiate the purchasing process today to see why so many customers depend on us for the NSN items they require.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-043-6195 Item Description: MICROCIRCUIT,MEMORY | 5962 | 010436195 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | U | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
91L02DM-B | 3 | 9 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 200.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
CZER | Memory Device Type | RAM |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CQZP | Input Circuit Pattern | 13 INPUT |
ADAT | Body Width | 0.278 INCHES MINIMUM AND 0.298 INCHES MAXIMUM |
CQSJ | Inclosure Material | CERAMIC AND GLASS |
TTQY | Terminal Type And Quantity | 16 PRINTED CIRCUIT |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND LOW POWER AND W/STORAGE AND W/DECODED OUTPUT |
ADAQ | Body Length | 0.770 INCHES MINIMUM AND 0.808 INCHES MAXIMUM |
AEHX | Maximum Power Dissipation Rating | 260.0 MILLIWATTS |
ADAU | Body Height | 0.085 INCHES MINIMUM AND 0.124 INCHES MAXIMUM |
TEST | Test Data Document | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
MRC | Decoded Requirement | Clear Text Reply |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFGA | Operating Temp Range | -55.0/+125.0 DEG CELSIUS |
CQWX | Output Logic Form | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CZEN | Voltage Rating And Type Per Characteristic | 7.0 VOLTS MAXIMUM POWER SOURCE |
CZZZ | Memory Capacity | UNKNOWN |
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