Whether you are in search of military and defense parts, aerospace parts, or other similar product solutions, Satellite To Submarine Parts is your one-stop shop. Thank you for your interest in part number IDT72V36100L15PFI, a Integrated Device Technology Inc item that is listed alongside the description “Microcircuit Memory” and the NSN 5962015898596. To guarantee a swift procurement process for NSN part number IDT72V36100L15PFI, be sure to request a quote by filling out and submitting the RFQ form below, and one of our experts will offer a customized solution for your comparisons in response.
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We list everything with as much relevant information as possible to ensure that customers can swiftly identify and procure the exact products they need. For instance, while part number IDT72V36100L15PFI is manufactured by Integrated Device Technology Inc, it is specifically done so under CAGE Code 61772, a unique identifier assigned to a particular facility by the DLA that supplies to various government or defense agencies. Additionally, using the first digits of the NSN 5962-01-589-8596, one can also determine that this part falls under FSC 5962 Microcircuits Electronic. Keeping this in mind, initiate the purchasing process today to see why so many customers depend on us for the NSN items they require.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-589-8596 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 015898596 | 0 | N | B | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | B | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| IDT72V36100L15PFI | 5 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| AFGA | Operating Temp Range | -40.0/+85.0 DEG CELSIUS |
| ADAU | Body Height | 1.6 MILLIMETERS MAXIMUM |
| CBBL | Features Provided | ASYNCHRONOUS AND SYNCHRONOUS AND PROGRAMMABLE AND HIGH PERFORMANCE |
| TTQY | Terminal Type And Quantity | 128 GULLWING |
| AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
| CWSG | Terminal Surface Treatment | SOLDER |
| CQSZ | Inclosure Configuration | FLAT PACK |
| ABHP | Overall Length | 21.9 MILLIMETERS MINIMUM AND 22.1 MILLIMETERS MAXIMUM |
| ADAT | Body Width | 13.9 MILLIMETERS MINIMUM AND 14.1 MILLIMETERS MAXIMUM |
| CXCY | Part Name Assigned By Controlling Agency | 3.3 VOLT HIGH DENSITY SUPERSYNC II 36 BIT FIFO 65,536 X 36 |
| MRC | Decoded Requirement | Clear Text Reply |
| ADAQ | Body Length | 19.9 MILLIMETERS MINIMUM AND 20.1 MILLIMETERS MAXIMUM |
| CTFT | Case Outline Source And Designator | MS-026BHB JOINT ELECTRON DEVICE ENGINEERING COUNCIL |
| CQSJ | Inclosure Material | PLASTIC |
| ABMK | Overall Width | 15.9 MILLIMETERS MINIMUM AND 16.1 MILLIMETERS MAXIMUM |
| CZEQ | Time Rating Per Chacteristic | 15.00 NANOSECONDS NOMINAL ACCESS |
| CZEN | Voltage Rating And Type Per Characteristic | 3.3 VOLTS NOMINAL INPUT |
| CQWX | Output Logic Form | COMPLEMENTARY-METAL OXIDE-SEMICONDUCTOR LOGIC |
| CZER | Memory Device Type | FIRST-IN FIRST-OUT |
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