Whether you are in search of military and defense parts, aerospace parts, or other similar product solutions, Satellite To Submarine Parts is your one-stop shop. Thank you for your interest in part number D2716, a Intel Corporation item that is listed alongside the description “Microcircuit Memory” and the NSN 5962011188116. To guarantee a swift procurement process for NSN part number D2716, be sure to request a quote by filling out and submitting the RFQ form below, and one of our experts will offer a customized solution for your comparisons in response.
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We list everything with as much relevant information as possible to ensure that customers can swiftly identify and procure the exact products they need. For instance, while part number D2716 is manufactured by Intel Corporation, it is specifically done so under CAGE Code 34649, a unique identifier assigned to a particular facility by the DLA that supplies to various government or defense agencies. Additionally, using the first digits of the NSN 5962-01-118-8116, one can also determine that this part falls under FSC 5962 Microcircuits Electronic. Keeping this in mind, initiate the purchasing process today to see why so many customers depend on us for the NSN items they require.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-01-118-8116 Item Description: MICROCIRCUIT,MEMORY | 5962 | 011188116 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
7 | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
D2716 | 3 | 1 | 5 |
MRC | Criteria | Characteristic |
---|---|---|
CZEQ | Time Rating Per Chacteristic | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT AND 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, HIGH TO LOW LEVEL OUTPUT |
AFGA | Operating Temp Range | +0.0/+70.0 DEG CELSIUS |
CZER | Memory Device Type | ROM |
CQZP | Input Circuit Pattern | 12 INPUT |
TEST | Test Data Document | 11530-312851 DRAWING (THIS IS THE BASIC GOVERNING DRAWING, SUCH AS A CONTRACTOR DRAWING, ORIGINAL EQUIPMENT MANUFACTURER DRAWING, ETC.; EXCLUDES ANY SPECIFICATION, STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAWING) |
CQSJ | Inclosure Material | CERAMIC |
TTQY | Terminal Type And Quantity | 24 PRINTED CIRCUIT |
ADAT | Body Width | 0.490 INCHES MINIMUM AND 0.510 INCHES MAXIMUM |
CWSG | Terminal Surface Treatment | SOLDER |
CBBL | Features Provided | HERMETICALLY SEALED AND MONOLITHIC AND PROGRAMMABLE AND PROGRAMMED AND W/ENABLE |
ADAQ | Body Length | 1.250 INCHES MAXIMUM |
ADAU | Body Height | 0.180 INCHES MAXIMUM |
MRC | Decoded Requirement | Clear Text Reply |
AGAV | End Item Identification | MSG GEN/RECDR 11530 |
CQSZ | Inclosure Configuration | DUAL-IN-LINE |
AFJQ | Storage Temp Range | -65.0/+150.0 DEG CELSIUS |
CZEN | Voltage Rating And Type Per Characteristic | 5.5 VOLTS MAXIMUM POWER SOURCE |
CQWX | Output Logic Form | TRANSISTOR-TRANSISTOR LOGIC |
CZZZ | Memory Capacity | UNKNOWN |
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