Whether you are in search of military and defense parts, aerospace parts, or other similar product solutions, Satellite To Submarine Parts is your one-stop shop. Thank you for your interest in part number 2117987-003, a Microsemi Corporation item that is listed alongside the description “Microcircuit Hybrid” and the NSN 5962011084106. To guarantee a swift procurement process for NSN part number 2117987-003, be sure to request a quote by filling out and submitting the RFQ form below, and one of our experts will offer a customized solution for your comparisons in response.
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We list everything with as much relevant information as possible to ensure that customers can swiftly identify and procure the exact products they need. For instance, while part number 2117987-003 is manufactured by Microsemi Corporation, it is specifically done so under CAGE Code 54485, a unique identifier assigned to a particular facility by the DLA that supplies to various government or defense agencies. Additionally, using the first digits of the NSN 5962-01-108-4106, one can also determine that this part falls under FSC 5962 Microcircuits Electronic. Keeping this in mind, initiate the purchasing process today to see why so many customers depend on us for the NSN items they require.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-108-4106 Item PartTypeName: MICROCIRCUIT,HYBRID | 5962 | 011084106 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| 7 | D | A | 9 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 2117987-003 | 5 | 9 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABHP | OVERALL LENGTH | 2.500 INCHES MAXIMUM |
| ABKW | OVERALL HEIGHT | 0.550 INCHES MAXIMUM |
| ABMK | OVERALL WIDTH | 2.264 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | 0.0 TO 100.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| AGAV | END ITEM IDENTIFICATION | GNHA 4920-01-121-6501 TEST STATION,E/I F-16 AIRCRAFT |
| CBBL | FEATURES PROVIDED | BEAM LEAD CHIP AND RADIATION SENSITIVE AND BURN IN AND HIGH POWER |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CSSL | DESIGN FUNCTION AND QUANTITY | 1 MEMORY |
| CXCY | PART NAME ASSIGNED BY CONTROLLING AGENCY | MICROCIRCUIT,HYBRID,HIGH SPEED MEMORY |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -7.0 VOLTS MAXIMUM POWER SOURCE AND-3.0 VOLTS MAXIMUM POWER SOURCE |
| CZES | HYBRID TECHNOLOGY TYPE | MULTICHIP |
| CZZZ | MEMORY CAPACITY | 1024 X 10 BITS |
| FEAT | SPECIAL FEATURES | MULTIPLE INPUT VOLTAGES |
| SUPP | SUPPLEMENTARY FEATURES | WITH ATTACHED HEAT SINK,15 MHZ WRITE CYCLE FREQUENCY,25 MHZ READ CYCLE FREQUENCY,40 MHZ CLOCK CYCLE FREQUENCY |
| TTQY | TERMINAL TYPE AND QUANTITY | 60 GULLWING |
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